Communication
      Automation

Corporation    

  About CAC    

          CAC Overview    

          CAC in the News    

          ADU - Algorithmic

  Development Unit
    

  Product    

          Index    

          Archives    

  Documentation    

          Manuals    

          Brochures    

  Software    

  Sales Offices    

          North America    

  Contact CAC to:    

          Register for

  Announcements    

          Request Technical

  Support    

          Send Us Your

  Requirements

    




 Relevant Links
 -  Heat Spreader Plates
 -  Front Panels
 -  Mezzanine Boards
 -  T1/E1 Audio Connections
 -  Wide-Ultra SCSI
 -  TDM Bus
 -  Foundation Board Features
 -  Foundation Board
 -  twleve Audio Channel Mezzanine
 -  DSP32C Mezzanine Board
 -  Empack
 -  Empack Accessories
 -  Empack Software
 -  Card Cages

 

 

Heat Spreader Plates

Heat spreader plates provide a mechanism to secure mezzanine boards and a large conductive surface to dissipate the heat generated by the DSP and memory devices. Thermal pads attach to the surface of these devices and to the heat spreader plate. Captured heat is conducted through the EmPack’s card cage and through vented holes. Where airflow is inadequate to keep the internal temperature below 70oC, fans can be mounted on the EmPack’s front panel.

 


 

Copyright © 2003 - 2010 Communication Automation Corporation